2020spring_Semiconductor Process_Department of Mechanical Engineering 3 A
Course Period：Now ~ Any Time
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Course Intro
Course Plan
教學目標：
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課程大綱
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01-1 ch1 introduction
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02 Ch2 clean room and wafer clean
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03 ch4 Silicon wafer
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04 Ch7 Plasma
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05 Ch 11 PVD
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06 CH10 CVD
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07 Ch6 Lithography 微影
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08 Ch9 etching
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09 CH8 DOPING
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10 ch5 氧化與熱處理
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11 CMP
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12 ch14_IC製程技術
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作業解答區
Teacher / 洪國永
Teacher /
Teacher /
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